DDR3 214 Pin Unbuffered Ruggedized Non ECC Micro-DIMM

Rugged SODIMMTwo holes at the top of this module allow it to be mounted to the main board for a secure fit.

Extended Temp.

amp inc Part Number Density Height(in) Module Config. Device Type Rank Description
AMP256TUU46ACA0P-TYY 2GB 1.34 256MX64 256MX16 1 Unbuffered RgMicro-DIMM™, non ECC
AMP256TUU46AFA0P-TYY 2GB 1.34 256MX64 256MX16 1 Unbuffered RgMicro-DIMM™, non ECC
AMP512TUU46A2A0P-TYY 4GB 1.34 512MX64 256MX16 1 Unbuffered RgMicro-DIMM™, non ECC

T= 0°C ≤ TA≤+85°C YY : Speed Bin, 86 = 800 CL6, 07 = 1066 CL7, 39 = 1333 CL9

Commercial Temp.

amp inc Part Number Density Height(in) Module Config. Device Type Rank Description
AMP256TUU46ACA0P-CYY 2GB 1.34 256MX64 256MX16 1 Unbuffered RgMicro-DIMM™, non ECC
AMP256TUU46AFA0P-CYY 2GB 1.34 256MX64 256MX16 1 Unbuffered RgMicro-DIMM™, non ECC
AMP512TUU46A2A0P-CYY 4GB 1.34 512MX64 256MX16 1 Unbuffered RgMicro-DIMM™, non ECC

C= 0°C to 70°C YY : Speed Bin, 86 = 800 CL6, 07 = 1066 CL7, 39 = 1333 CL9

Industrial Temp.

amp inc Part Number Density Height(in) Module Config. Device Type Rank Description
AMP256TUU46ACA0P-RYY 2GB 1.34 256MX64 256MX16 1 Unbuffered RgMicro-DIMM™, non ECC
AMP256TUU46AFA0P-RYY 2GB 1.34 256MX64 256MX16 1 Unbuffered RgMicro-DIMM™, non ECC
AMP512TUU46A2A0P-RYY 4GB 1.34 512MX64 256MX16 1 Unbuffered RgMicro-DIMM™, non ECC

R= -40°C to +85°C YY : Speed Bin, 86 = 800 CL6, 07 = 1066 CL7, 39 = 1333 CL9