Two holes at the top of this module allow it to be mounted to the main board for a secure fit.
Extended Temp.
amp inc Part Number |
Density |
Height(in) |
Module Config. |
Device Type |
Rank |
Description |
AMP256TUU46ACA0P-TYY |
2GB |
1.34 |
256MX64 |
256MX16 |
1 |
Unbuffered RgMicro-DIMM™, non ECC |
AMP256TUU46AFA0P-TYY |
2GB |
1.34 |
256MX64 |
256MX16 |
1 |
Unbuffered RgMicro-DIMM™, non ECC |
AMP512TUU46A2A0P-TYY |
4GB |
1.34 |
512MX64 |
256MX16 |
1 |
Unbuffered RgMicro-DIMM™, non ECC |
T= 0°C ≤ TA≤+85°C |
YY : Speed Bin, 86 = 800 CL6, 07 = 1066 CL7, 39 = 1333 CL9 |
Commercial Temp.
amp inc Part Number |
Density |
Height(in) |
Module Config. |
Device Type |
Rank |
Description |
AMP256TUU46ACA0P-CYY |
2GB |
1.34 |
256MX64 |
256MX16 |
1 |
Unbuffered RgMicro-DIMM™, non ECC |
AMP256TUU46AFA0P-CYY |
2GB |
1.34 |
256MX64 |
256MX16 |
1 |
Unbuffered RgMicro-DIMM™, non ECC |
AMP512TUU46A2A0P-CYY |
4GB |
1.34 |
512MX64 |
256MX16 |
1 |
Unbuffered RgMicro-DIMM™, non ECC |
C= 0°C to 70°C |
YY : Speed Bin, 86 = 800 CL6, 07 = 1066 CL7, 39 = 1333 CL9 |
Industrial Temp.
amp inc Part Number |
Density |
Height(in) |
Module Config. |
Device Type |
Rank |
Description |
AMP256TUU46ACA0P-RYY |
2GB |
1.34 |
256MX64 |
256MX16 |
1 |
Unbuffered RgMicro-DIMM™, non ECC |
AMP256TUU46AFA0P-RYY |
2GB |
1.34 |
256MX64 |
256MX16 |
1 |
Unbuffered RgMicro-DIMM™, non ECC |
AMP512TUU46A2A0P-RYY |
4GB |
1.34 |
512MX64 |
256MX16 |
1 |
Unbuffered RgMicro-DIMM™, non ECC |
R= -40°C to +85°C |
YY : Speed Bin, 86 = 800 CL6, 07 = 1066 CL7, 39 = 1333 CL9 |